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HTS material processing and synthesis takes place in the High Pressure & Low Temperature Physics Laboratory, equipped with a single crystal growth system, arc, and RF furnaces. Bulk materials are prepared in hot isostatic presses (200Mpa @ 1200oC), thin film growth capabilities include DC and RF sputtering, thermal evaporation, laser ablation, and co-evaporation systems. The lab includes a 100 PSI jet mill for sub-micron particles and a continuous wire plastic extrusion apparatus. (C. W. Chu, cwchu@uh.edu).

The HTS Wire and Large Grain Processing Laboratory offers equipment developed specifically for support of the High Pressure & Low Temperature Physics Laboratory, including magnetic field profile mapping for monolithic HTSrs, SQUID, SM and ac susceptometers, and X-ray, SEM, EDAX, and microprobe for structural and compositional determinations. (C. W. Chu, cwchu@uh.edu).

The HTS Theoretical Materials Research Laboratory has eight (8) double-processor Dell-workstations for numerical calculations of theoretical problems in HTS and advanced materials. (C. S. Ting, csting@mail.uh.edu).

The Raman & Infrared Research Laboratory has facilities for Raman and infrared spectroscopy. The recently acquired state-of-the-art triple Raman spectrometer T64000 (Horiba Jobin Yvon) is equipped with two liquid nitrogen cooled CCDs, microscope, XYZ computer controlled stage, and software for Raman imaging. The excitation sources are Ar+ and He-Ne lasers. Temperature-dependent Raman spectra can be measured under microscope between 5 and 300K using an Oxford Instruments optical cryostat and between 300 and 900K using a Linkam heating stage. The FTIR Bomem D8A spectrometer, allows infrared reflectance and transmission measurements between 10 and 24 000 cm-1 with spectral resolution of 0.03 cm-1. It is equipped with a cryostat for low-temperature studies down to 4.2 K and a set of five detectors, including liquid He cooled bolometer. (M. Iliev, miliev@uh.edu).

The HTS Thin Film Device Laboratory, located in the Cullen College of Engineering (CCE), conducts advanced lithography for VSLI, nanostructures and non-planar integrated circuits utilizing an ion beam proximity lithography system, two reactive ion etching systems, and a PMT high density plasma etching system. Operations include an electron beam evaporator, two sputtering systems, a dual ion beam deposition system, and a scanning electron microscope. (J. C. Wolfe, wolfe@uh.edu).

Also located at CCE is the TcSUH Materials Processing Laboratory, focusing on HTS wire fabrication and analysis utilizing a rolling mill with high quality surface finish for Ni cladding, a spin coating system and a dip coating system for buffer layer deposition, tube furnaces for heat treatment and annealing of films and substrates, a sputter coater for deposition of gold contacts, a cold isostatic pressing system (60 Ksi) and a hot isostatic pressing system (40 Ksi at 1200 °C) for powder consolitation, box furnaces for melt-texturing processes, a 1.5T magnet for Ic measurement in applied fields, and an optical microscope equipped with an image analysis system. (K. Salama, ksalama@uh.edu).

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